I can get some packaging advantages using COTS SODIMMs
in a design. Cost can be a wash with soldered-down
component memory.
Downsides of using COTS memory *modules* is they
entice users to remove/replace/upgrade/dick-with.
And, typically come with the added cost of a socket
(which is usually rated at just a handful of insertions).
Anyone tried soldering-down SODIMMs (or SIMMs/DIMMs)
in a production design? And, doing so in a way that
doesn't forfeit the equivalent amount of real-estate?
On 2024-07-31, Don Y <blockedofcourse@foo.invalid> wrote:
I can get some packaging advantages using COTS SODIMMs
in a design. Cost can be a wash with soldered-down
component memory.
Downsides of using COTS memory *modules* is they
entice users to remove/replace/upgrade/dick-with.
And, typically come with the added cost of a socket
(which is usually rated at just a handful of insertions).
Anyone tried soldering-down SODIMMs (or SIMMs/DIMMs)
Not going to work with any kind of DIMM as the contacts on both
sides serve diferent purposes.
It could work with simm
in a production design? And, doing so in a way that
doesn't forfeit the equivalent amount of real-estate?
You could solder them in a slot I guess, if you can handle high-rise
and deal with the routing issues.
But why not solder ram chips instead? you have to find room for the
chips, but you save on the space taken up by the connector.
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