Hello,


Yet more of my philosophy about 3D stacking technology..

I am a white arab from Morocco, and i think i am smart since i have also invented many scalable algorithms and algorithms..

I invite you to look at the following Asians from Institute of Microeletronics (IME) of Singapore that have just invented
a Quad-Layer 3D Wafer Stacking Technology that is able
to stack 4 dies and i think that they are better than
TSMC, so i think that they will be winners, but i repeat that
3D stacking is only limited to few staked layers, so 3D stacking doesn't scale well, read here about this new invention:

https://www.tomshardware.com/news/quad-layer-3d-stacking-technology-enables-chips-of-the-future

I invite you to look at the following interesting video:

What is the Maximum CPU Power?

https://www.youtube.com/watch?v=016CcStnsUw

And to read the following:

TSMC Teases 12-High 3D Stacked Silicon: SoIC Goes Extreme

https://www.anandtech.com/show/16026/tsmc-teases-12-high-3d-stacked-silicon

So as you are noticing that they are saying above that TSMC and Intel are able using 3D stacking only to stack few layers, for example TSMC is able to 3D stack 12 stacked dies, and Intel is able to also 3D stack just a few stacked dies, so then it is in
accordance with what i have said in my following thoughts that the problem with 3D stacking is Heat removal that is the issue and that is the problem, so i think that 3D stacking is not able to "scale" well because of heat, read my following thoughts so
that to understand more:

And read more of my thoughts about EUV (extreme ultra violet) and about 3D stacking in CPUs and more here:

https://groups.google.com/g/alt.culture.morocco/c/o-BJDe_WILo

Intel Starts Building Two New Chip Factories in Arizona

"Intel broke ground on two new chip factories in Chandler, Arizona. Intel will invest $20 billion in these factories.

Fab 52 and Fab 62 will manufacture Intel’s most advanced process technologies, including Intel 20A featuring the new RibbonFET and PowerVia innovations.

Intel is targeting completion in 2024. The Fabs will use EUV (extreme ultra violet)."

Read more here:

https://www.nextbigfuture.com/2021/09/intel-starts-building-two-new-chip-factories-in-arizona.html

And read more of my thoughts about EUV (extreme ultra violet) and about 3D stacking in CPUs and more here:

https://groups.google.com/g/alt.culture.morocco/c/o-BJDe_WILo

And read carefully my following thoughts about Nanotechnology and about Exponential Progress:

https://groups.google.com/g/alt.culture.morocco/c/mjE_2AG1TKQ


Thank you,
Amine Moulay Ramdane.

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